Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field
10+ years of experience in ASIC physical design for high-performance SoCs
Proven end-to-end expertise in RTL-to-GDSII flows using industry tools (Synopsys, Cadence, or Siemens)
Strong hands-on experience with timing closure, IR drop analysis, and ECO implementation
Deep understanding of physical design constraints for multi-clock, multi-voltage, and hierarchical SoCs
Experience with advanced FinFET process nodes
Prior experience managing or coordinating offshore/outsourced PD teams or vendors
Familiarity with DFT integration, STA sign-off, and power domain implementation (UPF/CPF)
Excellent communication, leadership, and cross-functional collaboration skills
Act as technical leader and subject-matter expert helping to teach, grow, and mentor others in the team
Exposure to radiation-hardened or space-qualified ASICs
Experience with chip-package co-design or advanced packaging (2.5D/3D)
Familiarity with physical design service vendor management or offshore collaboration
Experience driving tapeouts through TSMC
Experience with Gate-All-Around technologies
Experience working in cross-functional, geographically distributed teams