Advanced Packaging & Power Delivery Senior Engineer

🌍 УдалённоSeniorПолная занятость🌐 Глобал

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Наша компания

Axelera AI is not your regular deep-tech company. We are creating the next-generation AI platform to support anyone who wants to help advancing humanity and improve the world around us. In just five years, we have raised a total of $370 million and have built a world-class team of 250+ employees (including 60+ PhDs with more than 40,000 citations), both remotely from 20 different countries and with offices in Belgium, France, Switzerland, Italy, the UK, headquartered at the High Tech Campus in Eindhoven, Netherlands. We have also launched our Metis™ AI Platform, which achieves a 3-5x increase in efficiency and performance, and have visibility into a strong business pipeline exceeding $100 million. Our unwavering commitment to innovation has firmly established us as a global industry pioneer. Are you up for the challenge? Position Overview As a Senior Advanced Packaging & Power Delivery Engineer at Axelera AI, you will play a pivotal role in shaping the silicon and packaging architecture of our next-generation AI accelerators. You will own power-delivery design across the full stack - from on-die power grids to package and PCB PDN - and bring deep expertise in advanced packaging technologies to help us scale from today's products to tomorrow's multi-chiplet, 3D-integrated systems. Working within our R&D Custom Design team and collaborating closely with Silicon Engineering and AI Integrated Systems, you will be at the intersection of analog design, packaging innovation, and product delivery - with real ownership and direct impact on the chips we ship.

Чем предстоит заниматься

Own power-delivery design end to end, from on-die power grids to package and PCB PDN design and analysis

Lead advanced packaging architecture decisions for 2.5D/3D stacking, multi-chiplet integration, and interposer/substrate co-design

Perform SI/PI verification and sign-off across the full stack, ensuring power integrity and signal integrity targets are met

Collaborate with the AIIS and Silicon Engineering teams to align power delivery and packaging solutions with product and silicon requirements

Support thermal and integration reviews for current and future products

Develop and maintain power-delivery methodology, flows, and design guidelines within the Custom Design toolchain

Identify and mitigate single-point-of-failure risks in SI/PI workstreams; mentor and grow the team's packaging expertise

Engage with external partners, substrate/interposer vendors, and OSAT houses to co-develop advanced packaging solutions

Наши требования

Experience with SI/PI verification and sign-off methodologies

Familiarity with thermal modeling and co-simulation for integrated packages

Exposure to AI accelerator or custom ASIC design flows

Experience collaborating with OSAT partners, substrate vendors, or research institutes (e.g., imec)

Knowledge of advanced node custom and analog design practices

Location

Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, or a related field; PhD is a plus

7+ years of experience in power delivery and/or advanced packaging design in a semiconductor or deep-tech environment

Demonstrated expertise in on-die power grid design and package/PCB PDN analysis

Hands-on experience with 2.5D and/or 3D IC packaging technologies, multi-chiplet integration, and interposer/substrate co-design

Proficiency with industry-standard EDA tools for power integrity, PDN simulation, and package design

Ability to work cross-functionally and communicate complex technical trade-offs to diverse stakeholder groups

Strong written and spoken English communication skills

Мы предлагаем

Work from one of our Axelera AI offices (Leuven in Belgium, Amsterdam and Eindhoven in the Netherlands, Zurich in Switzerland, Florence and Milan in Italy or Bristol in the United Kingdom) if you're already based in the vicinity

Work fully remotely from any European country (incl. the UK) you are already in

Relocate with us and work from Italy (Florence or Milan) or the Netherlands (Amsterdam or Eindhoven)

Kindly note that priority will be given to candidates who are [interested in being] based in Belgium or Italy

What we offer

This is your chance to shape and be part of a dynamic, fast-growing, international organization. We offer an attractive compensation package, including a pension plan, extensive employee insurances and the option to get company shares

An open culture that supports creativity and continual innovation is awaiting you. Collaborative ownership and freedom with responsibility is characteristic for the way we act and work as a team

Технологии и навыки

engineer

Axelera AI

Europe

ГрейдSenior

ЗанятостьПолная занятость

ФорматУдалённо

ИсточникСкрыто

Опубликовано21 авг.

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